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Combination Mobile Crushing Plant

Combination Mobile Crushing Plant

Compared with fixed production lines,Combination Mobile Crusher have a shorter engineering period and rapider transition, which not only reduces the investment risk and opportunity cost of the investors, but also avoids the demolition and construction

C6X Series Jaw Crusher

C6X Series Jaw Crusher

C6X Jaw Crusher on structure and production efficiency present advanced modern technologies. Our Company's C6X Jaw Crusher can solve such problems of the existing jaw crushers as low production efficiency, difficult installation and maintenance. At pr

HGT Hydraulic Gyratory Crusher

HGT Hydraulic Gyratory Crusher

HGT Gyratory Crusher is a new-type intelligent coarse crusher with big capacity and high efficiency. It integrates mechanical, hydraulic, electric, automated, and intelligent controlling technologies which grant it with advantages traditional crushing

European Type Jaw Crusher PEW

European Type Jaw Crusher PEW

Jaw crushers has stationary jaw crusher, portable jaw crusher and mobile jaw crusher (crawler jaw crusher). Jaw crusher (PEW Series) is not only able to be used together with mine-selecting and gravel processing equipments but also be used independen

VSI5X Vertical Shaft Impact Crusher

VSI5X Vertical Shaft Impact Crusher

VSI Crushers Working Principle Raw material falls down into feed hopper, and then enters rotor through central entrance hole. It is accelerated in high-speed rotor, and then is thrown out at speed of 60-75m/s. When hitting anvil, it is crushed. Final

VSI Vertical Shaft Impact Crusher

VSI Vertical Shaft Impact Crusher

VSI Series vertical shaft impact crusher is designed by reputed German expert of SBM and every index is in worlds leading standard. It incorporates three crushing types and it can be operated 720 hours continuously. Nowadays, VSI crusher has replaced

VUS aggregate optimization system

VUS aggregate optimization system

The VU system is a global most-advanced dry-process sand-making system. The system is constructed like a tower. Its fully-enclosed layout features high integration. It integrates the functions of high-efficiency sand making, particle shape optimizatio

MTW-Z European Trapezium Mill

MTW-Z European Trapezium Mill

MTW European Grinding Mill is innovatively designed through deep research on grinding mills and development experience. It absorbs the latest European powder grinding technology and concept, and combines the suggestions of 9158 customers on grinding m

5X Series Roller Grinding Mill

5X Series Roller Grinding Mill

Grinding roller of MB5X Pendulum Roller Grinding Mill l adopts diluted oil lubrication. It is a technology initiated domestically which is maintenance-free and easy to operate. Diluted oil lubrication is oil bath lubrication, more convenient than grea

MTW Trapezium Mill

MTW Trapezium Mill

MTW European Grinding Mill is innovatively designed through deep research on grinding mills and development experience. It absorbs the latest European powder grinding technology and concept, and combines the suggestions of 9158 customers on grinding m

LM Vertical Mill

LM Vertical Mill

LM Vertical Grinding Mill integrates crushing, drying, grinding, separating and transport. The structure is simple while the layout is compact. Its occupational area is about 50% of that of the ball-milling system. The LM grinding mill can also be arr

TGM Trapezium Mill

TGM Trapezium Mill

TGM Super Pressure Trapezium Mill The operation principle of main unit of Trapezium mill is that main unit runs with the central shaft that is driven by a gear box. The top of the shaft is connected with a quincunx stand on which a grinding roller is

Thin Silicon Wafers The Process of Back Grinding for

Oct 22, 2019· Here’s a summary of the back-grinding process to achieve thin silicon wafers: Backside Thinning (or Back Grinding) Wafer grinding or backgrounding is the most popular method for thinning wafers. The dimension to which a wafer can be thinned depends heavily on the machine used, but most thin silicon wafers have around 50 micrometers thickness.

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Simulation of Back Grinding Process for Silicon Wafers

devices. Silicon wafer thickness greatly affects package size, thus thinner wafers result in smaller packaging dimensions. To manufacture the thinnest wafers possible requires a process called back grinding of the wafer, which also poses engineering challenges. In the Mechanical and Electrical Engineering Departments at the University of Idaho,

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Warping of silicon wafers subjected to back-grinding process

Apr 01, 2015· This study investigates warping of silicon wafers in ultra-precision grinding-based back-thinning process. By analyzing the interactions between the wafer and the vacuum chuck, together with the machining stress distributions in damage layer of ground wafer, the study establishes a mathematical model to describe wafer warping during the thinning process using the elasticity theory.

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Wafer backgrinding Wikipedia

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm. They are roughly 750 μm thick to ensure a minimum of mechanical stability and to avoid warping during high-temperature processing steps.

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Wafer Backgrinding Services Silicon Wafer Thinning Services

The backgrinding process involves using a diamond-resin bonded grinding wheel to remove the silicon material from the back of a silicon wafer. Using a grinding wheel is highly effective, and faster and less expensive than chemical-mechanical processes and is used to remove the bulk of substrate material prior to final finish grind, polish or

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Warping of silicon wafers subjected to back-grinding process

This study investigates warping of silicon wafers in ultra-precision grinding-based back-thinning process. By analyzing the interactions between the wafer and the vacuum chuck, together with the machining stress distributions in damage layer of ground wafer, the study establishes a mathematical model to describe wafer warping during the thinning process using the elasticity theory.

More

Warping of Silicon Wafers Subjected to Back-grinding Process

This study investigates warping of silicon wafers in ultra-precision grinding-based back-thinning process. By analyzing the interactions between the wafer and the vacuum chuck, together with the

More

Warping of silicon wafers subjected to back-grinding process

of silicon wafers subjected to back-grinding process Shang grinding-based back-thinning process is featured with a rotating wafer which is held by a vacuum chuck [3,8]. The wafer

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Semiconductor Back-Grinding IDC-Online

Semiconductor Back-Grinding The silicon wafer on which the active elements are created is a thin circular disc, typically 150mm or 200mm in diameter. During diffusion and similar processes, the wafer may become bowed, but wafers for assembly are normally stress relieved and can be regarded as flat.

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Simulation of Back Grinding Process for Silicon Wafers

devices. Silicon wafer thickness greatly affects package size, thus thinner wafers result in smaller packaging dimensions. To manufacture the thinnest wafers possible requires a process called back grinding of the wafer

More

Warping of silicon wafers subjected to back-grinding

of silicon wafers subjected to back-grinding process Shang grinding-based back-thinning process is featured with a rotating wafer which is held by a vacuum chuck [3,8]. The wafer

More

Study into grinding force in back grinding of wafer with

Aug 18, 2020· Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding

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Fast and precise surface measurement of back-grinding

Therefore, a modern wafer grinding machine begins with a coarse grinding wheel to get a fast removal of the silicon and at the end follows a fine grinding process step with small grit size grinding wheel. This final process

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Grinding of silicon wafers: A review from historical

Grinding of silicon wafers: A review from historical perspectives Z.J. Peia,, Graham R. Fisherb, J. Liua,c a Department of Industrial and Manufacturing Systems Engineering, Kansas State University,

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Grinding of silicon wafers: A review from historical

Oct 01, 2008· Their first model (DFG-83H/6) of wafer grinder was of creep-feed type, built in 1981, for back grinding of 150 mm silicon wafers. A later model (DFG840) of in-feed type was built in 1994 for back grinding of 200 mm wafers and its modified version (DFG840HS) was introduced to flattening of sliced wafers.

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Fine grinding of silicon wafers: designed experiments

Fine grinding of silicon wafers requires using #2000 mesh (3–6 µm grit size) or fi ner diamond wheels. The surfaces to be fi ne ground generally have no damage or very little damage and the surface roughness is 30 nm in Ra [6]. The uniqueness and the special requirements of silicon wafer fi ne grinding process

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Silicon wafer thinning, the singulation process, and die

Silicon wafer thinning, the singulation process, and die strength formed on the surface of a silicon wafer. Subsequently, in back-end production, the wafer backside is thinned and the wafer is singulated by For wafer thinning, the grinding process

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Silicon (Si) and Dicing Before Grinding (DBG) Process

Dicing Before Grinding (DBG) of silicon wafers is frequently used for the manufacturing of memory devices with stacked thin die used in mobile devices. It is also adopted in the manufacturing of a wide

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Silicon Wafer Manufacturing Process Silicon Valley

After the wafers have been sliced, the lapping process begins. Lapping the wafer removes saw marks and surface defects from the front and backside of the wafer. It also thins the wafer and helps to relieve stress accumulated in the wafer from the slicing process. After lapping the silicon wafers, they go through an etching and cleaning process.

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Study into grinding force in back grinding of wafer with

surface quality of the silicon wafer [8]. Hence, it is very important to study the grinding force and determine the relationship between grinding force and process parameters in order to reduce the surface/subsurface damage and optimize the back thinning process of the silicon wafer. Some scholars have studied the grinding

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How are Thin Silicon Wafers Made?

Feb 26, 2021· For this reason, those who manufacture silicon are compelled to improve the way they produce wafers that are thinner and handier than the conventional ones. If you want to take a closer look at the processes involved in creating this type of wafers, read on. The Processes Involved in Creating the Ultra-Thin Silicon Wafer Back Grinding

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