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Combination Mobile Crushing Plant

Combination Mobile Crushing Plant

Compared with fixed production lines,Combination Mobile Crusher have a shorter engineering period and rapider transition, which not only reduces the investment risk and opportunity cost of the investors, but also avoids the demolition and construction

C6X Series Jaw Crusher

C6X Series Jaw Crusher

C6X Jaw Crusher on structure and production efficiency present advanced modern technologies. Our Company's C6X Jaw Crusher can solve such problems of the existing jaw crushers as low production efficiency, difficult installation and maintenance. At pr

HGT Hydraulic Gyratory Crusher

HGT Hydraulic Gyratory Crusher

HGT Gyratory Crusher is a new-type intelligent coarse crusher with big capacity and high efficiency. It integrates mechanical, hydraulic, electric, automated, and intelligent controlling technologies which grant it with advantages traditional crushing

European Type Jaw Crusher PEW

European Type Jaw Crusher PEW

Jaw crushers has stationary jaw crusher, portable jaw crusher and mobile jaw crusher (crawler jaw crusher). Jaw crusher (PEW Series) is not only able to be used together with mine-selecting and gravel processing equipments but also be used independen

VSI5X Vertical Shaft Impact Crusher

VSI5X Vertical Shaft Impact Crusher

VSI Crushers Working Principle Raw material falls down into feed hopper, and then enters rotor through central entrance hole. It is accelerated in high-speed rotor, and then is thrown out at speed of 60-75m/s. When hitting anvil, it is crushed. Final

VSI Vertical Shaft Impact Crusher

VSI Vertical Shaft Impact Crusher

VSI Series vertical shaft impact crusher is designed by reputed German expert of SBM and every index is in worlds leading standard. It incorporates three crushing types and it can be operated 720 hours continuously. Nowadays, VSI crusher has replaced

VUS aggregate optimization system

VUS aggregate optimization system

The VU system is a global most-advanced dry-process sand-making system. The system is constructed like a tower. Its fully-enclosed layout features high integration. It integrates the functions of high-efficiency sand making, particle shape optimizatio

MTW-Z European Trapezium Mill

MTW-Z European Trapezium Mill

MTW European Grinding Mill is innovatively designed through deep research on grinding mills and development experience. It absorbs the latest European powder grinding technology and concept, and combines the suggestions of 9158 customers on grinding m

5X Series Roller Grinding Mill

5X Series Roller Grinding Mill

Grinding roller of MB5X Pendulum Roller Grinding Mill l adopts diluted oil lubrication. It is a technology initiated domestically which is maintenance-free and easy to operate. Diluted oil lubrication is oil bath lubrication, more convenient than grea

MTW Trapezium Mill

MTW Trapezium Mill

MTW European Grinding Mill is innovatively designed through deep research on grinding mills and development experience. It absorbs the latest European powder grinding technology and concept, and combines the suggestions of 9158 customers on grinding m

LM Vertical Mill

LM Vertical Mill

LM Vertical Grinding Mill integrates crushing, drying, grinding, separating and transport. The structure is simple while the layout is compact. Its occupational area is about 50% of that of the ball-milling system. The LM grinding mill can also be arr

TGM Trapezium Mill

TGM Trapezium Mill

TGM Super Pressure Trapezium Mill The operation principle of main unit of Trapezium mill is that main unit runs with the central shaft that is driven by a gear box. The top of the shaft is connected with a quincunx stand on which a grinding roller is

Wafer Edge Grinding Machine: W-GM-4200|Wafer

Wafer Edge Grinding Machine: W-GM-4200 Catalog (319.6KB) Customer Support. Feature. Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment.

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Edge Grinder,wafer edge Edge Shaping Products TOSEI

Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that

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Wafer Edge Grinding Machine: W-GM-5200|Wafer

Wafer Edge Grinding Machine: W-GM-5200 Catalog (361.8KB) Customer Support. Feature. Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment.

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Edge Grinding — Aptek Industries Inc.

Edge grinding, aka Edge Profiling, is critical to the manufacturing of all semiconductor wafers and wafers that are used in the manufacture of many other processes, such as Sapphire, Quartz, Alumina or Silicon Carbide. Edge grinding is critical to the safety and survivability of the wafer.

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Edge Grinding AxusTech

Edge Grinding. Edge grinding, also known as Edge Profiling, is a process that is common to the manufacture of nearly all semiconductor related wafers and wafers that are used in the manufacture of many other electronic, solar, and nanotechnology devices. The edge grinding step is critical to the safety of the wafer edge.

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Edge chipping of silicon wafers in diamond grinding

Jan 01, 2013· Fig. 2 presents two different grinding modes: down-grinding and up-grinding. When an abrasive grain on the grinding wheel removes the wafer material from the edge to the center along path MO, the chip thickness decreases from the start of the cut until it is zero at the end of the cut and the mode is called down-grinding; otherwise, it is called up-grinding.

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Wafer Edge Grinding Machine ACCRETECH

Wafer Edge Grinding Machine Best Seller Machine W-GM-Series Improve the Space Efficiency by the Compact Design Highly Accurate Grinding by the Synchronized X・Y・θ Support Control Easy Operation by Touch Panel Measuring of Grinding Result and Automatic Correction TOSEI ENGINEERING CORP.

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TOP DaitronWaferEdgeGrinder

Introducing the Edge Grinder series that brings NC-controlled grinding to the chamfering process on silicon and other wafers for the first time in the world. Besides the WBM series, in wide use and still regarded as the industry standard, we will be releasing the

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Wafer Manufacturing System|Semiconductor Manufacturing

Wafer Edge Grinding Machine: W-GM-5200. Top Share in 300 mm Si Market. Catalog PDF (361.8KB) Wafer Edge Grinding Machine: W-GM-4200. Capable of Grinding Various Material & Wafer Size. Catalog PDF (319.6KB) About Semiconductor Manufacturing Equipment. Customer Support. Semiconductor Production Process .

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US5679060A Wafer grinding machine Google Patents

A wafer grinding machine as set forth in claim 4 wherein said measuring station includes a rotatable chuck for receiving and rotating a wafer thereon, a sensor for scanning the edge of a wafer rotated with said chuck and generating a sequence of signals in response thereto, and processing means for determining the size, shape and geometric

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DE19535616B4 Wafer edge grinding device Google Patents

Grinding machine for a wafer edge, comprising: a grinder (12, 76) which rotates a chamfering wheel (64) and / or a polishing wheel (65; 80) for an edge of a wafer, and the chamfering and / or polishing wheel (64, 65 80) is moved up to a position where an edge of the wafer is to be chamfered or ground; a platform (16) which moves towards and away from the grinder (12; 76); a rotating means (36

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wafer edge grinding Edge Shaping Products TOSEI

Wafer edge can be mirror finished by the edge grinding process. Roughness of Ra = 20 nm is achieved (SiC). It reduces the cost by shortening the manufacturing process and improving the yield.

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Edge Shaping Products TOSEI ENGINEERING CORP.

Tosei Engineering develops and manufactures wafer edge grinding machine for semiconductor wafer and other substrates, customized processing machine.

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WAFER EDGE GRINDING PROCESS (Wafer Edge Profiling

e. Edge flaking during grinding f. Edge grinding is a time consuming process affects total CoO g. It is challenging to hold tolerances to SEMI specifications. Axus Technology’s Solution. The solution to being able to produce accurate and repeatable wafer edge profiles is to be able to

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Ultra-Thin Grinding Grinding Solutions DISCO Corporation

the Wafer Edge with edge trimming. the Wafer Edge without edge trimming. Improving Die Strength (Stress Relief) The processing quality of ultra-thin finishing grinding can also be improved by using the Poligrind wheel, but a layer of powder (albeit slight) remains on the wafer surface due to processing using a grinding wheel.

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반도체 Wafer용 Edge Grinding Machine의구조 안정화를 위한

It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers.

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Grinding wheels for manufacturing of silicon wafers: A

The grinding process referred in this paper is the vertical spindle surface grinding (a.k.a. wafer grinding) using a cup wheel. A typical cup wheel is illustrated in Fig. 1. Fig. 2 illustrates the wafer grinding process. During grinding, the grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed

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Process study on large-size silicon wafer grinding by

The grinding machine was equipped with two aerostatic spindles for work and wheel rotation, and had two degrees of freedom along X- and Z-axis directions. In addition, the work spindle was able to be precisely Fig. 3 External view of g round wafer s urface s Edge Edge 3. 2 Ebina, Yoshimatsu, Zhou, Shimizu, Onuki and Ojima,

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Semiconductor Silicon Wafer Polishing Machines

Our grinding, lapping, mechanical and chemical polishing machines for substrates of all diameters provide process results defining the leading edge in terms of local and global geometries. LAPMASTER WOLTERS is key supplier of silicon wafer polishing machines capable to polish wafer up to

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Edge chipping of silicon wafers in diamond grinding

Jan 01, 2013· Fig. 2 presents two different grinding modes: down-grinding and up-grinding. When an abrasive grain on the grinding wheel removes the wafer material from the edge to the center along path MO, the chip thickness decreases from the start of the cut until it is zero at the end of the cut and the mode is called down-grinding; otherwise, it is called up-grinding.

More